Recently, Realme had claimed that they are going to launch their 5G smartphone at the Mobile World Congress 2020 and now they have announced the Realme X50 Pro 5G smartphone which is a 5G enabled device that runs the latest Qualcomm Snapdragon 865 SoC and has a dual-camera hole-punch mechanism on the display.
Today Realme shared a post on Weibo in which it has announced that they will unveil the upcoming Realme X50 Pro 5G flagship smartphone on February 24th at its first-ever global conference at this year’s Mobile World Congress. This event will mark the company’s take on the global market.
Realme X50 Pro 5G Configurations –
Here, you can see a screenshot of the upcoming Realme X50 Pro 5G which was shared by the Realme China CMO Xu Qi Chase. According to the screenshot, the upcoming Realme flagship will be running on the latest Qualcomm Snapdragon 865 SoC with 12GB LPDDR5 RAM and 256 GB of UFS 3.0 internal storage.
The X50 Pro also has the Snapdragon X55 5G modem that gives it support for 5G connectivity. Talking about the display, there is not much known about it but according to the rumors, the screen will be an AMOLED full HD+ display with a 1080 x 2400pixel resolution in a 20:9 aspect ratio. Apart from these specifications, there will also be a dual-camera hole-punch setup and a 120Hz of refresh rate with the display.
The Realme X50 Pro 5G is definitely a smartphone to wait for and after the success of the Realme X2 Pro, this new device is sure to create a lot of hype before its launch on February 24th.