Qualcomm is planning to launch an integrated 5G modem and R-F system that can accumulate 5G mmWave and sub-6 bands including a smaller antenna. It is going to be the world’s first 5nm 5G baseband chip which will enhance the 5G performance globally for premium phones. The Snapdragon X60 will be the third generation of Qualcomm’s 5G modem integrated with an RF system. If you don’t know, the Snapdragon X50 commenced 5G and the Snapdragon X55 is currently being used in the latest Samsung smartphones. The Snapdragon X60 is developed to scale 5G devices and to allow carriers to be pliable with the spectrum and optimize performance.
One of the biggest features of the Snapdragon X60 is the mmWave-sub6 aggregation which according to Qualcomm allows the maximum throughput of 5.5Gbps. 5G is a combination of mmWave which are high-frequency bands that are blazingly fast but the con is, it can be blocked by the tiniest things like a piece of paper or a droplet of water -and sub6, lower-frequency bands that can penetrate buildings, but aren’t as swift.
The Snapdragon X60 comes with the first 5nm 5G baseband design. It has the ability to accumulate multiple 5G bands and combinations including mmWave and sub-6 using Frequency Division Duplex (FDD) and Time Division Duplex (TDD). Also, the modem is equipped with the Qualcomm QTM535 mmWave antenna module with a more solid design. The 5G modem-to-antenna system can deliver up to 7.5 Gbps download speeds with 3 Gbps upload speeds.
If you recall correctly, the Snapdragon X55 was 7nm which is bigger compared to X60 as it is a 5nm chip. I personally think its a good initiative from Qualcomm as a smaller antenna means that it can fit into a thinner and sleeker form factor.
The X60 will be sampled in the first quarter of the year 2020 and will be integrated into devices from early 2021.