Qualcomm introduces Snapdragon 865, Snapdragon 765, and Snapdragon 765G on the first day of its Technology Summit 2019 at Maui, Hawaii. These chipsets will be used in upcoming Android phones next year. The 865 SoC is aimed for flagship devices, while the 765/765G will power the upper mid-range smartphones.
Qualcomm’s new Snapdragon 865 supports Snapdragon X55 5G modem for connectivity, which was launched earlier this year. Additionally, the X55 modem is more power-efficient, has higher download and upload speeds, more bandwidths at sub-6GHz frequencies, and supports mmWave.
Moreover, the SD 865 will support up to 200-megapixel camera along with up to 8K video recording at 30fps. In addition to that, it has 25 percent better graphics capabilities than the previous SD 855 and has an AI performance. Xiaomi’s Mi 10 will be the first smartphone to feature Snapdragon 865. Oppo, along with Motorola, has also confirmed to launch SD 865 powered phones in the Q1 of 2020.
The Snapdragon 765 and 765G come with an integrated X52 5G modem. According to Qualcomm, the X52 modem will offer up to 3.7Gbps download speed, mmWave support, Dynamic Spectrum Sharing (DSS), NSA, and SA network architectures. The G in SD 765G stands for gaming and will support select features form the Snapdragon Elite Gaming platform.
The OPPO Reno 3 and Redmi K30 from Xiaomi will be among the first phones to be powered by it. Other manufacturers, including HMD Global, Motorola, LG, OPPO, realme, Redmi, and Vivo, have also confirmed to launch 5G phones powered by Snapdragon 765.
However, Qualcomm didn’t provide much details about the new chipsets. More information about the chipsets will be share on the second day of Summit. The company also announced 3D Sonic Max, an ultrasonic in-screen fingerprint scanning technology, offering 17x larger fingerprint scanning area (30mm x 20mm) and supports two-finger authentication at the same time.