Xiaomi has been constantly sharing the features of its upcoming phone Mi 9 Pro 5G ahead of the launch on September 24 in the company’s home market. Now, Xiaomi has confirmed that Qualcomm Snapdragon 855+ chipset will power the Mi 9 Pro 5G smartphone.[wpinsertshortcodead id=”zxikm5d3e04a8f1451″]
The teaser poster also reveals that the device will be equipped with a custom XL VC Liquid Cooling module with a heat dissipation area of 1,127mm2. It will have 5-layer graphite, high thermal conductivity copper foil, and a thermal gel to use a “three-dimensional cooling system” which will minimize the CPU core temperature level by 10.2 ° C.
Furthermore, a teaser poster also validated that the phone will include a customized “transverse direct motor” to obtain a powerful sense of vibration– haptic feedback that has a start-stop speed of 10ms, much like a mechanical keyboard. With this Vibration HD feature, the phone will use a 4D immersive gaming experience.[wpinsertshortcodead id=”bzyqm5d3e04029f48f”]
Previously the Chinese manufacturer revealed that the device would be equipped with 40W wired fast charging, 30W wireless fast charging and 10W reverse charging support. The company claims that the 30W Super Wireless Flash charging can charge a 4000mAh battery up to 50% in just 25 minutes and 69 minutes to charge fully. However, the 48W wired fast charging will charge the device from 0% to 100% in 48 minutes only.
TEENA certified Mi 9 Pro 5G reveals that the device will feature a 6.39-inch display with 12GB of RAM and 512GB of internal storage. We also think that the smartphone will run on MIUI 11. In addition to the Mi 9 Pro 5G, Xiaomi is likewise set to present its brand-new Mi MIX 4 flagship smart device which might include a 100-megapixel camera sensing unit.[wpinsertshortcodead id=”zxikm5d3e04a8f1451″]