After MediaTek launched the Dimensity 800 earlier this year, the chipmaker company today announced Dimensity 800U chipset. This is the sixth Dimensity branded chipset from the company to bring 5G connectivity for more upcoming mid-range smartphones.
The Dimensity 800U is an octa-core chipset developed using the FinFET technology of 7nm TSMC. This contains two clocked ARM Cortex-A76 cores up to 2.4GHz and six clocked Cortex-A55 cores up to 2.0GHz. It is coupled with the ARM Mali-G57 MC3 GPU which is also found aboard the 800 and 720 Dimensions.
“MediaTek has always focused on enhancing the user experience with our leading semiconductor technology, whether consumers are streaming, gaming or taking photos,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “MediaTek’s Dimensity 800U brings cutting-edge, next-gen technology to the Dimensity SoC series, bringing MediaTek’s advanced 5G, imaging and multimedia technologies to high-performance 5G smartphones that deliver incredible 5G experiences.”
The Dimensity 800U is integrated with 5G modem with sub-6Ghz SA, and NSA networks support and also supports 5G+5G dual SIM dual standby backed by MediaTek’s 5G UltraSave Technology.
The new chipset will support up to 120Hz displays with FHD+ resolution and will support HDR10+ integrated with MediaTek’s MiraVision technology to enhance the playback content. It will support up to 12GB LPDDR4x RAM (2133MHz) and UFS 2.2 internal storage. The company also includes an independent AI Processing Unit (APU) and Image Signal Processor (ISP) for improved camera and security.
In terms of optics, the chipset will support up to a single 64MP sensor or 20MP+16MP in a dual-camera configuration. The chipset will support up to 4K video shooting, HDR-ISP, multi-frame noise reduction, and more camera features.
The company is expected to launch smartphones powered by Dimensity chipsets in Q4 of 2020 globally.