Intel has unveiled its new low-power x86 CPU micro architecture code-named Tremont, which will be integrated within Lakefield chipsets. Lakefield processors combine a hybrid CPU architecture Tremont with Intel’s 3D packaging Technology Foveros for thin and light form factors. Lakefield processors will power the recently announced dual-screen Surface Neo.[wpinsertshortcodead id=”zxikm5d3e04a8f1451″]
Tremont features an Intel Core-Class branch predictor with a 6-wide (2×3-wide clustered) out-of-order decoder for improved performance. It also has four wide allocation, ten execution ports on the back-end, and dual load/store pipelines. It comes with configurations up to quad-core and 4.5MB of L2 cache. However, the size of the L2 cache will depend on the product.
The low-power CPU architecture delivers significant instructions per cycle (IPC) gains gen-over-gen prior to Intel’s previous generation’s low-power chips. Tremont also supports few technologies from Intel which includes:
- Accelerator interfacing Instructions
- Efficient and Scalable work-dispatch and synchronization to accelerators
- CPU rooted secure boot
- Intel Trusted Execution Technology
- Intel Boot Guard
- Intel Speed Shift
- Improved responsiveness with faster hardware controlled frequency changes
- Intel Total Memory Encryption
- Improve Confidentiality protection in memory form physical attacks
However, the company didn’t provide any release date for it. It’s been almost a year since Lakefield was introduced, so we don’t have to wait much longer.