AMD’s launch of the Ryzen 3000 series processors marks an occasion that was nearly unthinkable a few short years ago: AMD has taken the process lead over Intel by fielding new 7nm processors that contain smaller and more densely-packed transistors than Intel’s competing 14nm chips. The advantages of increased density come in the form of higher performance, better power efficiency, more cores, and more cache packed into a smaller area than the first-gen Ryzen models, all of which makes third-gen Ryzen a potent adversary for Intel both on the desktop and in the data center.
AMD paved the way for the ‘Matisse’ Ryzen 3000 series several years ago when it unveiled the revolutionary chiplet-based Zen microarchitecture. At the time, AMD laid out a roadmap that included a steady cadence of tick-tock-like updates interspersed with new revisions of the scalable microarchitecture. After the company’s sophomore effort with the second-gen Ryzen processors, which featured a faster process paired with the same first-gen Zen design, the company is plowing forward with its Zen 2 architecture that AMD says offers up to 15% more instructions per cycle (IPC). Paired with the advantages of the 7nm process and more cores, not to mention AMD’s trailblazing of the PCIe 4.0 interface on desktop platforms, the Ryzen 3000 chips promise an explosive step forward in performance.
AMD’s first chips to come packing TSMC’s 7nm process span the entire range of the mainstream desktop stack, but push core counts up from eight cores to 12 cores and 24 threads with the Ryzen 9 3900X we have in the lab today, upsetting the status quo and bringing mainstream platforms into what used to be the realm of the pricey high end desktop. If you’re looking for something even beefier, AMD also has the 16-core 32-thread Ryzen 9 3950X coming in September.
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